Precision BGA Support: Holds iPhone 11 / 11 Pro / 11 Pro Max motherboards securely during IC rework and soldering.
A13 Chip Compatibility: Designed specifically for the Apple A13 Bionic chipset, ensuring proper alignment and heat management.
Heat-Resistant Design: Built to withstand high temperatures during hot-air or reflow operations.
Stable Work Surface: Firm base minimizes wobble for accurate chip placement and soldering.
Professional Grade: Ideal for technicians performing BGA reballing, chip replacement, and micro-soldering repairs.