Replacement Power Amplifier (PA) IC chip for SAMSUNGsung Galaxy S6 and S6 Edge

Chip model: AFEM-9010 - integrated front-end module for signal amplification

Handles signal amplification for network connectivity (2G/3G/4G LTE)

"BIG" refers to the main PA component in the RF section

Restores proper signal reception and transmission

High-quality component for reliable network performance

Solves network issues like no service, weak signal, or dropped calls

Compatible with both S6 (G920) and S6 Edge (G925) variants

Essential for advanced motherboard repairs

Professional micro-soldering installation required