Fixes the problem:

Used when a chip needs to be removed and resoldered due to faulty connections

Helps repair boot loops, no power, or other motherboard-level issues

Essential for reballing after replacing an IC (like CPU, eMMC, or power management chip)

Ensures precise solder ball placement for reliable connections

Features & Specifications:

Part Type: BGA Stencil / Reballing Template

Compatible Models:

Samsung Galaxy S22 Ultra (SM-S908U, SM-S908B)

Also compatible with ZenFone 10, Find X6 Pro, and other models using similar chip packages

Application: Motherboard mid-layer reballing / IC reballing

Condition: 100% Brand New

Material: Deformation‑resistant material for repeated use

Design: Precise pin location with square‑round hole design for accurate solder paste application

Advantages:

High durability – resists bending or warping during use

Laser‑cut for exact alignment

Good material quality for consistent reballing results

Professional Use Only: This tool is intended for experienced phone repair technicians. Requires proper equipment (hot air station, flux, solder paste) and skills.