GIPADM BGA Rework Preheating Station / BGA Board Replacement Part.

This tool is used for BGA (Ball Grid Array) chip rework, soldering, and desoldering on iPad and smartphone logic boards. It provides controlled preheating to prevent board warping during IC replacement.

Completely fit and work with professional micro-soldering stations and iPad logic board repair applications.

Product Specifications:

Compatible with: Universal BGA Rework Stations / iPad Logic Board Repair

Product name: BGA Preheating Board / Rework Platform

Model: For Professional Micro-Soldering

Features: Professional-grade BGA rework preheating platform/Provides uniform heat distribution to prevent board warping/Compatible with most BGA rework stations and hot air soldering tools/Ideal for iPad, iPhone, and MacBook logic board repairs/Precision temperature control support