Product Name: Bencisy Solder Paste – 183°C Melting Point
Tool Type: Lead‑free solder paste for micro‑soldering
Function: Used for reflow soldering of surface‑mount components (ICs, connectors, flex cables) on logic boards
Melting Point: 183°C (low‑temperature lead‑free)
Application: Ideal for iPhone, iPad, Samsung, and other smartphone motherboard repairs
Included: Syringe with solder paste
Usage: Apply with soldering iron, hot air station, or stencil for precise component placement
High quality aftermarket solder paste for professional electronics repair