Product Name: WYLIE 0.3 / 0.35 / 0.4 / 0.5 BGA Board (WL-53)
Compatible Model: Universal
Type: BGA Reballing Platform Board

Function:
Supports BGA chip reballing process
Holds IC chips securely during repair
Ensures accurate alignment of solder balls
Improves precision in soldering work
Suitable for multiple IC sizes (0.3–0.5mm)

Installation: Professional repair tool (technician use)
Condition: New Tool