Product Name: PRECISION BGA STENCILS FOR CPU MSM8976/8956 (RL-044)
Compatible Models: Qualcomm MSM8976 (Snapdragon 652) and MSM8956 (Snapdragon 650) – used in various Android devices
Type: BGA Reballing Stencil Set
Function: Enables accurate solder ball placement during CPU reballing for MSM8976/8956 processors
Installation: Tool – no installation required
Condition: Compatible Replacement Part
Usage: Suitable for professional Android CPU reballing and motherboard repair