Engineered to securely hold BGA chips and PCBs in alignment during rework and soldering operations.
Made from durable materials that resist heat and wear, ensuring stable performance during repeated use.
Able to withstand high temperatures during hot‑air rework and soldering procedures without deformation.
Compatible with a wide range of devices and IC package sizes commonly used in mobile phone motherboard repairs.
Flat, firm base that minimizes wobble, giving technicians greater control when aligning components or using hot‑air stations.
Built for use by technicians in BGA rework stations, micro soldering tables, and precision repair environments.